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NTD30N02
Power MOSFET
30 Amps, 24 Volts
N ? Channel DPAK
Designed for low voltage, high speed switching applications in
power supplies, converters and power motor controls and bridge
circuits.
Features
? Pb ? Free Packages are Available
http://onsemi.com
30 AMPERES
24 VOLTS
R DS(on) = 11.2 m W (Typ.)
Typical Applications
? Power Supplies
? Converters
? Power Motor Controls
? Bridge Circuits
MAXIMUM RATINGS (T J = 25 ° C unless otherwise noted)
G
N ? Channel
D
S
Rating
Drain ? to ? Source Voltage
Gate ? to ? Source Voltage ? Continuous
Drain Current
? Continuous @ T A = 25 ° C
? Single Pulse (t p v 10 m s)
Total Power Dissipation @ T A = 25 ° C
Operating and Storage Temperature Range
Single Pulse Drain ? to ? Source Avalanche
Energy ? Starting T J = 25 ° C
(V DD = 24 Vdc, V GS = 10 Vdc,
L = 1.0 mH, I L (pk) = 10 A, R G = 25 W )
Symbol
V DSS
V GS
I D
I DM
P D
T J , T stg
E AS
Value
24
" 20
30
100
75
? 55 to
150
50
Unit
Vdc
Vdc
Adc
Apk
W
° C
mJ
4
1 2
3
DPAK
CASE 369C
STYLE 2
MARKING
DIAGRAM
4
Drain
2
1 Drain 3
Gate Source
Thermal Resistance
? Junction ? to ? Case
? Junction ? to ? Ambient (Note 1)
? Junction ? to ? Ambient (Note 2)
Maximum Lead Temperature for Soldering
Purposes, 1/8 ″ from case for 10 seconds
R q JC
R q JA
R q JA
T L
1.65
67
120
260
° C/W
° C
D30N02 = Device Code
Y = Year
WW = Work Week
G = Pb ? Free Device
ORDERING INFORMATION
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits
are exceeded, device functional operation is not implied, damage may occur
and reliability may be affected.
1. When surface mounted to an FR4 board using 1 in. pad size,
(Cu Area 1.127 sq in).
2. When surface mounted to an FR4 board using minimum recommended pad
size, (Cu Area 0.412 sq in).
Device
NTD30N02
NTD30N02G
NTD30N02T4
NTD30N02T4G
Package
DPAK
DPAK
(Pb ? Free)
DPAK
DPAK
(Pb ? Free)
Shipping ?
75 Units/Rail
75 Units/Rail
2500 Tape & Reel
2500 Tape & Reel
?For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
? Semiconductor Components Industries, LLC, 2006
February, 2006 ? Rev. 3
1
Publication Order Number:
NTD30N02/D
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